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INTEGRATED CIRCUITS
DATA SHEET
TDA4863J; TDA4863AJ Vertical deflection booster
Product specification File under Integrated Circuits, IC02 2000 Aug 17
Philips Semiconductors
Product specification
Vertical deflection booster
FEATURES * Power amplifier with differential inputs * Output current up to 3 A (p-p) * High vertical deflection frequency up to 200 Hz * High linear sawtooth signal amplification * Flyback generator: - TDA4863J: separate adjustable flyback supply voltage up to 60 V - TDA4863AJ: internally doubled supply voltage (two supply voltages only for DC-coupled outputs).
TDA4863J; TDA4863AJ
GENERAL DESCRIPTION The TDA4863J and TDA4863AJ are deflection boosters for use in vertical deflection systems for frame frequencies up to 200 Hz. The TDA4863J needs a separate flyback supply voltage, so the supply voltages are independently adjustable to optimize power consumption and flyback time. For the TDA4863AJ the flyback supply voltage will be generated internally by doubling the supply voltage and therefore a separate flyback supply voltage is not needed. Both circuits provide differential input stages and fit well with the TDA485X monitor deflection controller family.
QUICK REFERENCE DATA Measurements referenced to ground (pin GND). SYMBOL VP1 VP2 VFB VP3 I5(p-p) IP1 IP2 VINP VINN Tamb PARAMETER supply voltage 1 (pin 1) supply voltage 2 for vertical output (pin 3) flyback supply voltage of TDA4863J (pin 2) flyback generator output voltage of TDA4863AJ (pin 2) vertical output current (pin 5) (peak-to-peak value) supply current 1 (pin 1) quiescent supply current 2 (pin 3) input voltage (pin 7) input voltage (pin 6) ambient temperature during scan I5 = 0 I5 = -1.5 A CONDITIONS 9 VP1 - 1 VP1 - 1 0 - - - 1.6 1.6 -20 MIN. - - - - - 6 25 - - - TYP. MAX. 30 60 60 UNIT V V V
VP1 + 2.2 V 3 10 60 A mA mA
VP1 - 0.5 V VP1 - 0.5 V +75 C
ORDERING INFORMATION PACKAGE TYPE NUMBER NAME TDA4863J TDA4863AJ DBS7P DESCRIPTION plastic DIL-bent-SIL power package; 7 leads (lead length 12/11 mm); exposed die pad VERSION SOT524-1
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Philips Semiconductors
Product specification
Vertical deflection booster
BLOCK DIAGRAM
TDA4863J; TDA4863AJ
handbook, full pagewidth
THERMAL PROTECTION
TDA4863J
DIFFERENTIAL INPUT STAGE
VERTICAL OUTPUT
FLYBACK GENERATOR
REFERENCE CIRCUIT
7 INP
6 INN
5 V-OUT RS1 CS1
4 GND
3 VP2
2 VFB D1
1 VP1
C1
C4
C2
RP R3 from TDA485X R2
deflection coil R4 R1 VN VF VP
MHB714
Fig.1 Block diagram of TDA4863J.
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Philips Semiconductors
Product specification
Vertical deflection booster
TDA4863J; TDA4863AJ
handbook, full pagewidth
THERMAL PROTECTION
TDA4863AJ
DIFFERENTIAL INPUT STAGE
VERTICAL OUTPUT
FLYBACK GENERATOR
REFERENCE CIRCUIT
7 INP
6 INN
5 V-OUT RS1 CS1
4 GND
3 VP2 CF
2 VP3
1 VP1
D1 RP R3 from TDA485X R2 deflection coil C1 R6 R1 VN VP
MHB715
R5
C2
Fig.2 Block diagram of TDA4863AJ.
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Philips Semiconductors
Product specification
Vertical deflection booster
PINNING PIN SYMBOL TDA4863J VP1 VFB VP3 VP2 GND V-OUT INN INP 1 2 - 3 4 5 6 7 TDA4863AJ 1 - 2 3 4 5 6 7
TDA4863J; TDA4863AJ
DESCRIPTION positive supply voltage 1 flyback supply voltage flyback generator output supply voltage 2 for vertical output ground or negative supply voltage vertical output inverted input of differential input stage non-inverted input of differential input stage
handbook, halfpage
handbook, halfpage
VP1 VFB VP2 GND V-OUT INN INP
1 2 3 4 5 6 7
MHB716
VP1 VP3 VP2
1 2 3 4 5 6 7
MHB717
TDA4863J
GND V-OUT INN INP
TDA4863AJ
Fig.3 Pin configuration of TDA4863J.
Fig.4 Pin configuration of TDA4863AJ.
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Philips Semiconductors
Product specification
Vertical deflection booster
FUNCTIONAL DESCRIPTION Both the TDA4863J and TDA4863AJ consist of a differential input stage, a vertical output stage, a flyback generator, a reference circuit and a thermal protection circuit. The TDA4863J operates with a separate flyback supply voltage (see Fig.1) while the TDA4863AJ generates the flyback voltage internally by doubling the supply voltage (see Fig.2). Differential input stage The differential sawtooth input signal (e.g. coming from the deflection controller family TDA485X) is connected to the inputs (inverted signal to pin 6 and non-inverted signal to pin 7). The vertical feedback signal is superimposed on the inverted signal on pin 6. Vertical output and thermal protection The vertical output stage is a quasi-complementary class-B amplifier with a high linearity. The output stage is protected against thermal overshoots. For a junction temperature Tj > 150 C this protection will be activated and will reduce then the deflection current (I5).
TDA4863J; TDA4863AJ
Flyback generator The flyback generator supplies the vertical output stage during flyback. The TDA4863J is used with separate flyback supply voltage to achieve a short flyback time with minimized power dissipation. The TDA4863AJ needs a capacitor CF between pins 2 and 3 (see Fig.2). Capacitor CF is charged during scan, using the external diode D1 and resistor R5. During flyback the cathode of capacitor CF is connected to the positive supply voltage and the flyback voltage is then twice the supply voltage. For the TDA4863AJ the resistor R6 in the positive supply line can be used to reduce the power consumption. In parallel with the deflection coil a damping resistor RP and an RC combination (RS1 = 5.6 and CS1 = 100 nF) are needed. Furthermore, another additional RC combination (RS2 = 5.6 and CS2 = 47 to 150 nF) can be used to minimize the noise effect and the flyback time (see Figs 9 and 10).
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Philips Semiconductors
Product specification
Vertical deflection booster
TDA4863J; TDA4863AJ
LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 60134); voltages referenced to ground (pin 4); unless otherwise specified. SYMBOL VP1 VP2 VFB VP3 Vi(6,7) Vo(5) IP2 Io(5) I2 Tstg Tamb Tj Ves Notes 1. Internally limited by thermal protection; will be activated for Tj 150 C. 2. Equivalent to discharging a 200 pF capacitor through a 0 series resistor. THERMAL CHARACTERISTICS SYMBOL Rth(j-mb) Note 1. To minimize the thermal resistance from mounting base to heatsink [Rth(mb-h)] follow the recommended mounting instruction: screw mounting preferred; torque = 40 Ncm; use heatsink compound; isolation plate increases Rth(mb-h). PARAMETER thermal resistance from junction to mounting base CONDITIONS note 1 VALUE 6 UNIT K/W PARAMETER supply voltage 1 (pin 1) supply voltage 2 (pin 3) flyback supply voltage of TDA4863J (pin 2) flyback generator output voltage of TDA4863AJ (pin 2) input voltage on pins 6 and 7 output voltage on pin 5 supply current 2 (pin 3) output current (pin 5) flyback current on pin 2 storage temperature ambient temperature junction temperature electrostatic discharge voltage on all pins note 1 note 2 note 1 CONDITIONS - - - 0 - - - - - -25 -20 - -300 MIN. MAX. 40 60 60 VP1 + 3 VP1 62 1.8 1.8 1.8 +150 +75 150 +300 V V V V V V A A A C C C V UNIT
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Philips Semiconductors
Product specification
Vertical deflection booster
TDA4863J; TDA4863AJ
CHARACTERISTICS VP1 = 25 V; V4 = 0 V; Tamb = 25 C; voltages referenced to ground (pin 4); unless otherwise specified. SYMBOL Supplies VP1 VP2 VFB VP3 IP1 IP2 VINP VINN IINP IINN I2 V3-2 supply voltage 1 (pin 1) supply voltage 2 (pin 3) flyback supply voltage of TDA4863J (pin 2) flyback generator output voltage of TDA4863AJ (pin 2) supply current 1 (pin 1) quiescent supply current 2 (pin 3) I5 = -1.5 A during scan I5 = 0 9 VP1 - 1 VP1 - 1 0 - - 1.6 1.6 - - - - - - - 6 25 - - -100 -100 - 30 60 60 V V V PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
VP1 + 2.2 V 10 60 mA mA
Differential input stage input voltage (pin 7) input voltage (pin 6) input quiescent current (pin 7) input quiescent current (pin 6) VP1 - 0.5 V VP1 - 0.5 V -500 -500 1.5 nA nA
Flyback generator current during flyback voltage drop during flyback of TDA4863J reverse forward V2-1 voltage drop during flyback of TDA4863AJ reverse forward Vertical output stage; see Fig.5 I5 I5(p-p) V5-4 V5-3 LIN Note 1. Deviation of the output slope at a constant input slope. 2000 Aug 17 8 vertical deflection output current vertical deflection output current on pin 5 (peak-to-peak value) output saturation voltage to ground output saturation voltage to VP2 non-linearity of output signal I5 = 1 A I5 = 1.5 A I5 = 1 A I5 = 1.5 A note 1 - - - - -2.3 -2.8 - - - 1.4 1.8 -2 -2.3 - 1.5 3 1.7 2.3 - - 1 A A V V V V % I5 = -1 A I5 = -1.5 A I5 = 1 A I5 = 1.5 A - - - - -1.5 -2 2.2 2.5 - - - - V V V V I5 = -1 A I5 = -1.5 A I5 = 1 A I5 = 1.5 A - - - - -1.5 -2 2.2 2.5 - - - - V V V V A
Philips Semiconductors
Product specification
Vertical deflection booster
TDA4863J; TDA4863AJ
handbook, full pagewidth
input signal on pin INN
t
input signal on pin INP
t VFB(1) output voltage on pin V-OUT V P1 GND
t
deflection current through the coil
t
MHB718
(1) VFB for TDA4863J; 2VP1 for TDA4863AJ.
Fig.5 Timing diagram.
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Philips Semiconductors
Product specification
Vertical deflection booster
INTERNAL PIN CONFIGURATION
TDA4863J; TDA4863AJ
handbook, full pagewidth
INP 7
INN 6
V-OUT GND 5 4
VP2 3
VFB 2
VP1 1
TDA4863J
MHB719
Fig.6 Internal circuits of TDA4863J.
handbook, full pagewidth
INP 7
INN 6
V-OUT GND 5 4
VP2 3
VP3 2
VP1 1
TDA4863AJ
MHB720
Fig.7 Internal circuits of TDA4863AJ.
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Philips Semiconductors
Product specification
Vertical deflection booster
APPLICATION INFORMATION
TDA4863J; TDA4863AJ
handbook, full pagewidth
VF VP 2 > 1 k guard output HIGH = error
TDA4863J
5
1N4448 2.2 BC556 22 F vertical output signal 3.3 k
BC548 220 k
MHB721
Fig.8 Application circuit with TDA4863J for external guard signal generation.
handbook, full pagewidth
THERMAL PROTECTION
TDA4863J
DIFFERENTIAL INPUT STAGE
VERTICAL OUTPUT
FLYBACK GENERATOR
REFERENCE CIRCUIT
7 INP
6 INN
5 V-OUT
RS1 CS1
4 GND
3
VP2
2 VFB D1
BYV27 470 F
1 VP1
CS2
(1)
R3 1.8 k
from TDA485X
RS2 5.6
RP
270
5.6 100 nF deflection coil
470 F
470 F
4.3
VF
R2 1.8 k
R1
1 (1 W)
VN -8 V
VP +9 V
MHB722
+50 V
Attention: the heatsink of the IC must be isolated against ground of the application (it is connected to pin 4). (1) With CS2 (typical value between 47 and 150 nF) the flyback time and the noise behaviour can be optimized.
Fig.9 Application circuit with TDA4863J.
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Philips Semiconductors
Product specification
Vertical deflection booster
TDA4863J; TDA4863AJ
handbook, full pagewidth
THERMAL PROTECTION
TDA4863AJ
DIFFERENTIAL INPUT STAGE
VERTICAL OUTPUT
FLYBACK GENERATOR
REFERENCE CIRCUIT
7 INP
6 INN
5 V-OUT RS1 CS1 5.6 100 nF RP
270
4 GND
3 VP2 CF
100 F R5 (2) 240 (2 W)
2 VP3
1 VP1
D1
BYV27 470 F
CS2(1)
R3 1.8 k
from TDA485X
RS2 5.6
deflection coil
470 F
3.9 (2 W)
R6 (3)
R2 1.8 k
R1
1 (1 W)
VN -12.5 V
VP +12.5 V
MHB723
Attention: the heatsink of the IC must be isolated against ground of the application (it is connected to pin 4). (1) With CS2 (typical value between 47 and 150 nF) the flyback time and the noise behaviour can be optimized. (2) With R5 capacitor CF will be charged during scan and the value (typical value between 150 and 270 ) depends on Idefl, tflb and CF. (3) R6 reduces the power dissipation of the IC. The maximum possible value depends on the application.
Fig.10 Application circuit with TDA4863AJ.
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Philips Semiconductors
Product specification
Vertical deflection booster
Example for both TDA4863J and TDA4863AJ Table 1 Values given from application VALUE 0.71 6 6 270 1 1.8 1.8
(1)
TDA4863J; TDA4863AJ
Calculation formulae for power consumption: P IC = P tot - P defl UNIT A mH k k V C C K/W K/W R deflcoil + R1 2 P defl = ------------------------------- x I defl(max) 3 where PIC = power dissipation of the IC Ptot = total power dissipation Pdefl = power dissipation of the deflection coil. Calculation formulae for maximum required thermal resistance for the heatsink at Tj(max) = 110 C: T j(max) - T amb R th(mb-amb) = ---------------------------------- - R th(j-mb) = 19 K/W (max.) - P IC Table 3 UNIT tflb (s) 350 V V W W W K/W C Table 4 tflb (s) 360 290 240 tflb as a function of VP1 and VN for TDA4863AJ VP1 (V) 10 12.5 15 VN (V) -10 -12.5 -15 PIC (W) 2.5 3.2 3.9 R6 () 1 3.9 6.8 250 210 tflb as a function of VFB for TDA4863J VFB (V) 30 40 50 + ( V P1 - V N ) x 0.01 A + 0.2 W I defl(max) I defl(max) P tot = ( V P1 - U D1 ) x ------------------- + V N x ------------------4 4
SYMBOL Idefl(max) Ldeflcoil Rdeflcoil RP R1 R2 R3 VFB Tamb Tdeflcoil Rth(j-mb) Rth(mb-amb) Note 1. For TDA4863J only. Table 2
50 60 75 6 8
Calculated values VALUE
SYMBOL TDA4863J VP1 VN Ptot Pdefl PIC Rth(tot) Tj(max) 9 -8 3.2 1.2 2 14 88 TDA4863AJ 12.5 -12.5 4.4 1.2 3.2 14 105
VP1, VN and VFB are referenced to ground of application; voltages are calculated with +10% tolerances. Calculation formulae for supply voltages: VP1 = -V5-3 + (R1 + Rdeflcoil) x Idefl(max) - U'L + UD1 VN = V5-4 + (R1 + Rdeflcoil) x Idefl(max) + U'L where U'L = Ldeflcoil x 2Idefl(max) x fv fv = vertical deflection frequency UD1 = forward voltage drop across D1.
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Philips Semiconductors
Product specification
Vertical deflection booster
PACKAGE OUTLINE
TDA4863J; TDA4863AJ
DBS7P: plastic DIL-bent-SIL power package; 7 leads (lead length 12/11 mm); exposed die pad
SOT524-1
non-concave x Eh
q1
Dh D D1 P k view B: mounting base side A2 q2
E
B
q
L2 L
L3
L1
1 Z e1 e bp
7
wM 0 5 scale e e1 e2 k L L1 L2 L3 4.5 3.7 10 mm
Q m e2
c
vM
DIMENSIONS (mm are the original dimensions) UNIT A2(2) bp mm c D(1) D1(2) Dh E(1) Eh 3.5
m 2.8
P
Q
q
q1
q2
v 0.8
w
x
Z(1) 2.92 2.37
2.7 0.80 0.58 13.2 6.2 2.3 0.65 0.48 12.8 5.8
14.7 3.0 12.4 11.4 6.7 3.5 2.54 1.27 5.08 14.3 2.0 11.0 10.0 5.5
3.4 1.15 17.5 4.85 3.8 3.1 0.85 16.3 3.6
0.3 0.02
Notes 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. 2. Plastic surface within circle area D1 may protrude 0.04 mm maximum. OUTLINE VERSION SOT524-1 REFERENCES IEC JEDEC EIAJ EUROPEAN PROJECTION ISSUE DATE 98-11-12 00-07-03
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Philips Semiconductors
Product specification
Vertical deflection booster
SOLDERING Introduction to soldering through-hole mount packages This text gives a brief insight to wave, dip and manual soldering. A more in-depth account of soldering ICs can be found in our "Data Handbook IC26; Integrated Circuit Packages" (document order number 9398 652 90011). Wave soldering is the preferred method for mounting of through-hole mount IC packages on a printed-circuit board. Soldering by dipping or by solder wave The maximum permissible temperature of the solder is 260 C; solder at this temperature must not be in contact with the joints for more than 5 seconds.
TDA4863J; TDA4863AJ
The total contact time of successive solder waves must not exceed 5 seconds. The device may be mounted up to the seating plane, but the temperature of the plastic body must not exceed the specified maximum storage temperature (Tstg(max)). If the printed-circuit board has been pre-heated, forced cooling may be necessary immediately after soldering to keep the temperature within the permissible limit. Manual soldering Apply the soldering iron (24 V or less) to the lead(s) of the package, either below the seating plane or not more than 2 mm above it. If the temperature of the soldering iron bit is less than 300 C it may remain in contact for up to 10 seconds. If the bit temperature is between 300 and 400 C, contact may be up to 5 seconds.
Suitability of through-hole mount IC packages for dipping and wave soldering methods SOLDERING METHOD PACKAGE DIPPING DBS, DIP, HDIP, SDIP, SIL Note 1. For SDIP packages, the longitudinal axis must be parallel to the transport direction of the printed-circuit board. suitable suitable(1) WAVE
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Philips Semiconductors
Product specification
Vertical deflection booster
DATA SHEET STATUS DATA SHEET STATUS Objective specification PRODUCT STATUS Development
TDA4863J; TDA4863AJ
DEFINITIONS (1) This data sheet contains the design target or goal specifications for product development. Specification may change in any manner without notice. This data sheet contains preliminary data, and supplementary data will be published at a later date. Philips Semiconductors reserves the right to make changes at any time without notice in order to improve design and supply the best possible product. This data sheet contains final specifications. Philips Semiconductors reserves the right to make changes at any time without notice in order to improve design and supply the best possible product.
Preliminary specification
Qualification
Product specification
Production
Note 1. Please consult the most recently issued data sheet before initiating or completing a design. DEFINITIONS Short-form specification The data in a short-form specification is extracted from a full data sheet with the same type number and title. For detailed information see the relevant data sheet or data handbook. Limiting values definition Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 60134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Applications that are described herein for any of these products are for illustrative purposes only. Philips Semiconductors make no representation or warranty that such applications will be suitable for the specified use without further testing or modification. DISCLAIMERS Life support applications These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips Semiconductors customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips Semiconductors for any damages resulting from such application. Right to make changes Philips Semiconductors reserves the right to make changes, without notice, in the products, including circuits, standard cells, and/or software, described or contained herein in order to improve design and/or performance. Philips Semiconductors assumes no responsibility or liability for the use of any of these products, conveys no licence or title under any patent, copyright, or mask work right to these products, and makes no representations or warranties that these products are free from patent, copyright, or mask work right infringement, unless otherwise specified.
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Philips Semiconductors
Product specification
Vertical deflection booster
NOTES
TDA4863J; TDA4863AJ
2000 Aug 17
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Philips Semiconductors
Product specification
Vertical deflection booster
NOTES
TDA4863J; TDA4863AJ
2000 Aug 17
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Philips Semiconductors
Product specification
Vertical deflection booster
NOTES
TDA4863J; TDA4863AJ
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For all other countries apply to: Philips Semiconductors, Marketing Communications, Building BE-p, P.O. Box 218, 5600 MD EINDHOVEN, The Netherlands, Fax. +31 40 27 24825 (c) Philips Electronics N.V. 2000
Internet: http://www.semiconductors.philips.com
SCA 70
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights.
Printed in The Netherlands
753504/01/pp20
Date of release: 2000
Aug 17
Document order number:
9397 750 07125

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